Cadence leverages IBM Cloud HPC to accelerate electronic chip and system design software development

Today, IBM (IBM: NYSE) announced Cadence Design Systems, Inc. (Nasdaq: CDNS), is leveraging high-performance computing (HPC) with IBM Cloud HPC to help develop its chip and system design software faster. With more than 30 years of computational software experience, Cadence helps companies deliver innovative electronic products, including chips, boards and systems for dynamic market applications such as hyperscale computing, 5G communications, automotive, mobile, aerospace, consumer, industrial and healthcare. 

Building on its decades long history of delivering electronic design innovation and offering hosted design services, Cadence started its public cloud journey in 2016 and has since evolved to adopt a hybrid, multi-cloud approach, which includes IBM. The company has leveraged multiple research and development (R&D) workloads in IBM Cloud to achieve a variety of benefits, including those related to resiliency, performance, security, compliance and total cost of ownership. 

With the integrated IBM Spectrum LSF deployed in a hybrid cloud solution for HPC, Cadence is able to flexibly manage its compute-intensive workloads on-premises and in the cloud with high levels of resiliency and performance. Using IBM HPC both on-prem and on IBM Cloud, Cadence can take advantage of the solution to address compute demand peaks while helping to mitigate the risk of downtime, which benefits enablement of strategic R&D work.

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